|
T&D |
Transmission and Distribution. |
|
T |
Tera (10^12) |
|
t |
Time in seconds |
|
T |
Torque |
|
T |
Transformer |
|
T.A.B |
Technical Advisory Board |
|
T.A.C.S |
Total Access Communication System |
|
T.A.F.F |
Thermally Activated Flux Flow |
|
T.A.P |
Tool Application Program |
|
T.A.S |
Trace analysis system |
|
T.A.T |
Turnaround time |
|
T.A.X |
Trunk Automatic Exchange. |
|
T.B |
Tight Binding |
|
T.B.C |
Time-based competitiveness |
|
T.C |
Time constant; temperature coefficient |
|
T.C |
ThermoCouple; Time Compression; Temperature Cycle |
|
T.C.A |
Test Calibration Assembly |
|
T.C.A.D |
Technology computer-aided design |
|
T.C.C |
Tactical Cell Controller; Temperature Coefficient of Capacitance |
|
T.C.D.M |
Tool development cost model |
|
T.C.E |
Temperature Coefficient of Expansion |
|
T.C.I |
Tele-Communications, Inc. |
|
T.C.M |
Tunneling current microscopy |
|
T.C.N |
Transparent Content Negotiation |
|
T.C.O |
Total Cost of Ownership |
|
T.C.P |
Transfer Call Protocol. |
|
T.C.P |
Transformer-Coupled Plasma; Tape Carrier Package |
|
T.C.P |
Transmission Control Protocol. |
|
T.C.P/I.P |
Transmission Control Protocol/Internet Protocol |
|
T.C.R |
Temperature Coefficient of Resistance |
|
T.C.S |
Temperature Coefficient Sensitivity |
|
T.C.X.O |
Temperature Compensated Crystal Oscillator |
|
T.D |
Thermal Donor(s); Thermal desorption |
|
T.D.D |
Time Division Duplex. |
|
T.D.D.B |
Time-dependent dielectric breakdown |
|
T.D.E.V |
Transport-level deviation |
|
T.D.M |
Time Division Multiplexing. |
|
T.D.M.A |
Time Division Multiple Access. |
|
T.D.M.S |
Thermal Desorption Mass Spectrometry |
|
T.D.R |
Time-Domain Reflectometry |
|
T.D-S.C.D.M.A |
Time Division Synchronous Code-Division Multiple-Access |
|
T.E |
Tail End; Transmitted Electron |
|
T.E |
Transverse electric |
|
T.E.A |
Transverse excited atmosphere |
|
T.E.C |
Thermal expansion coefficient; Test and Electrical
Characterization; Thermo electric coolers |
|
T.E.C.A.P |
Transistor electrical characterization and analysis program |
|
T.E.D |
Transient enhanced diffusion; transmitted electron detection |
|
T.E.G |
Technical exchange group |
|
T.E.G.F.E.T |
Two-dimensional Electron Gas Field-Effect Transistors |
|
T.E.M |
Transmission Electron Microscopy; Tunneling Electron Microscopy;
Transverse ElectroMagnetic mode |
|
T.E.S |
Two Electron Satellite |
|
T.F.C |
Total Fault Coverage; Thin Film Capacitor |
|
T.F.E |
Tetrafluorethylene (teflon) |
|
T.F.E.D |
Thin Film Electroluminescent Display |
|
T.F.M.S.L |
Thin Film Micro Strip Line |
|
T.F.N |
Thin Film Network |
|
T.F.R |
Terrain Following Radar; Thin Film Resistor |
|
T.F.T |
Thin Film Transistor. |
|
T.F.X |
Toxic effects |
|
T.G.A |
Thermal gas analysis; TrueVision Targa image format |
|
T.H |
Through hole |
|
T.H.C |
Total hydrocarbons |
|
T.H.E.E.D |
Transmission High Energy Electron Diffraction |
|
T.H.T |
Two Hole Transition; Through hole technology |
|
T.I.F |
Tagged Image File image format |
|
T.I.F.F |
Tag Image File Format. |
|
T.I.R |
Total indicator runout; Total internal reflection |
|
T.I.S |
Tool induced shift |
|
T.L.C |
Thin layer chromatography |
|
T.L.E |
Tool loading elevator |
|
T.L.M |
Tape-laying machine; Telemeter; Transition line model |
|
T.L.S |
Transport Layer Security |
|
T.L.V |
Threshold limit value |
|
T.L.V/T.W.A |
Threshold limit value/time-weighted average |
|
T.M |
Transport Module; Transition Metal |
|
T.M |
Transverse magnetic |
|
T.M.A |
Thermo mechanical analyzer; |
|
T.M.C |
Transport module controller; Transfer module controller |
|
T.M.L |
Total mass loss |
|
T.M.O |
Telegraphic Money Order. |
|
T.N.C |
Threaded Neill Concelman connector |
|
T.O |
Transistor outline package |
|
T.O.A |
Take-off angle |
|
T.O.C |
Total organic carbon; Total oxidizable carbon |
|
T.O.I |
Third Order Intercept |
|
T.O.P |
Technical and Office Protocol |
|
T.P |
True position |
|
T.P.D |
Temperature program desorption |
|
T.P.G |
Test pattern generation |
|
T.P.M |
Total Productive Maintenance; Total Productive Manufacturing |
|
T.P.M.S |
Tire Pressure Monitoring System |
|
T.P.M.S |
Tyre Pressure Monitoring Sensors. |
|
T.P.R.S |
Temperature programmed reaction spectroscopy |
|
T.P.U |
Thermal processing unit |
|
T.Q |
Total quality |
|
T.Q.F.P |
Thin Quad Flat Pack |
|
T.Q.M |
Total Quality Management. |
|
T.R |
Transmit-receive |
|
T.R.A.C.T |
Transportable Remote Area Communications Terminal. |
|
T.R.F |
Transition Reflection Formalism |
|
T.R.I.M |
Transport of Ions in Matter |
|
T.R.L |
Through Reflect Line |
|
T.R.O.N |
The Realtime Operation System Nucleus |
|
T.S |
Transport Stream |
|
T.S.C |
Thermally Stimulated Current |
|
T.S.C.A |
Toxic Substances Control Act |
|
T.S.C.A.P |
Thermally Stimulated CAPacitance |
|
T.S.F.Z |
Traveling Solvent Floating Zone |
|
T.S.I |
Time Slot Interchanger |
|
T.S.O.P |
Thin Small Outline Package. |
|
T.S.P |
Temperature-sensitive parameter |
|
T.S.S.O.P |
Thin Shrink Small Outline Package |
|
T.T |
Technology trasnsfer |
|
T.T.A |
Telecommunications Technology Association |
|
T.T.C |
Telecommunication Technology Committee |
|
T.T.D |
True Time Delay |
|
T.T.L |
Transistor-transistor logic |
|
T.T.L |
Through the lens |
|
T.T.V |
Total thickness variation |
|
T.V |
Tele Vision. |
|
T.V.A.C |
Thermal VACuum (chamber) |
|
T.V.R.O |
TV Receive Only |
|
T.V.S |
Triangular voltage sweep |
|
T.W.A |
Time-weighted average |
|
T.W.G |
Technical Working Group |
|
T.W.T |
Traveling wave tube |
|
T.X.R.F |
Total X-ray fluorescence |
|
T/C |
Thermocompression |
|
T/S |
ThermoSonic |
|
T1 |
1,544 Mb/s |
|
T3 |
44,736 Mb/s |
|
Ta |
Tantalum |
|
TeleTransInfoCom |
Telecommunications-Transaction-Information-Communication. |
|
temp |
Temperature |
|
tera |
1.00E+12 |
|
THz |
Terahertz |
|
T-M |
Time-to-market |
|
ToD |
Time of Day |
|
ToR |
Top of range |
|
ToS |
Type of Service |
|
TOW |
Tube-launched, Optical-tracked, Wire-guided (Missile) |